MC74F174J
vs
74F174SJ
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP16,.3
|
5.30 MM, EIAJ TYPE2, SOP-16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Length |
19.495 mm
|
10.2 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
80000000 Hz
|
80000000 Hz
|
| Max I(ol) |
0.02 A
|
0.02 A
|
| Number of Bits |
6
|
1
|
| Number of Functions |
1
|
6
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
45 mA
|
45 mA
|
| Propagation Delay (tpd) |
11 ns
|
11 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
2.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
5.3 mm
|
| fmax-Min |
140 MHz
|
80 MHz
|
| Base Number Matches |
4
|
3
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MC74F174J with alternatives
Compare 74F174SJ with alternatives