MC74F157AN
vs
74F157APC
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
FAIRCHILD SEMICONDUCTOR CORP
|
Package Description |
DIP, DIP16,.3
|
0.300 INCH, PLASTIC, MS-001, DIP-16
|
Reach Compliance Code |
unknown
|
unknown
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e3
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.02 A
|
0.02 A
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supply Current-Max (ICC) |
23 mA
|
23 mA
|
Prop. Delay@Nom-Sup |
11 ns
|
7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
TTL
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
4
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
HTS Code |
|
8542.39.00.01
|
Family |
|
F/FAST
|
Length |
|
19.305 mm
|
Number of Outputs |
|
1
|
Output Polarity |
|
TRUE
|
Propagation Delay (tpd) |
|
7 ns
|
Seated Height-Max |
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Width |
|
7.62 mm
|
|
|
|
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