Findchips: Compare MC74F11D vs N74F11D,623

MC74F11D vs N74F11D,623 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MOTOROLA INC	NXP SEMICONDUCTORS
Part Package Code	SOIC	SOIC
Package Description	SOP, SOP14,.25	PLASTIC, MS-012AB, SOT108-1, SOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	F/FAST	F/FAST
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e0	e4
Length	8.65 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	AND GATE	AND GATE
Max I(ol)	0.02 A	0.02 A
Number of Functions	3	3
Number of Inputs	3	3
Number of Terminals	14	14
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Equivalence Code	SOP14,.25	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Power Supply Current-Max (ICC)	9.7 mA	9.7 mA
Prop. Delay@Nom-Sup	6.6 ns	6.6 ns
Propagation Delay (tpd)	6.5 ns	6.6 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	TTL	TTL
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	TIN LEAD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	3.9 mm	3.9 mm
Base Number Matches	3	1
Manufacturer Package Code		SOT108-1
Factory Lead Time		4 Weeks
Moisture Sensitivity Level		1
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates