MC74F113ND
vs
I74F113D-T
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP, DIP14,.3
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
|
| Length |
18.86 mm
|
8.65 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
19 mA
|
21 mA
|
| Propagation Delay (tpd) |
7 ns
|
7.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.69 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| fmax-Min |
|
80 MHz
|
|
|
|
Compare MC74F113ND with alternatives
Compare I74F113D-T with alternatives