Findchips: Compare MC74F113DDR2 vs N74F113D,602

MC74F113DDR2 vs N74F113D,602 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MOTOROLA INC	NXP SEMICONDUCTORS
Part Package Code	SOIC	SOIC
Package Description	SOP,	SOP, SOP14,.25
Pin Count	14	14
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	F/FAST	F/FAST
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
Length	8.65 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	J-K FLIP-FLOP	J-K FLIP-FLOP
Number of Bits	2	2
Number of Functions	2	2
Number of Terminals	14	14
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Polarity	COMPLEMENTARY	COMPLEMENTARY
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Power Supply Current-Max (ICC)	19 mA	21 mA
Propagation Delay (tpd)	7 ns	7 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	TTL	TTL
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Trigger Type	NEGATIVE EDGE	NEGATIVE EDGE
Width	3.9 mm	3.9 mm
Base Number Matches	1	1
Rohs Code		Yes
Max Frequency@Nom-Sup		80000000 Hz
Max I(ol)		0.02 A
Package Equivalence Code		SOP14,.25
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		40
fmax-Min		80 MHz
	Logic » FF/Latches	Logic » FF/Latches