MC74ACT139N vs TC74ACT139P feature comparison

MC74ACT139N Freescale Semiconductor

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TC74ACT139P Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS TOSHIBA CORP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.024 A 0.024 A
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5 V
Prop. Delay@Nom-Sup 11 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 16
ECCN Code EAR99
HTS Code 8542.39.00.01
Family ACT
Input Conditioning STANDARD
Length 19.25 mm
Output Polarity INVERTED
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 10.5 ns
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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