MC74AC573DWR2 vs TC74AC573FW feature comparison

MC74AC573DWR2 onsemi

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TC74AC573FW Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP20,.4 SOP, SOP20,.4
Pin Count 20 20
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AC
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 235 NOT SPECIFIED
Prop. Delay@Nom-Sup 15 ns 18.2 ns
Propagation Delay (tpd) 15 ns 17.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.7 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 4 1
Pbfree Code Yes
Additional Feature NOT AVAILABLE IN JAPAN
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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