MC74AC32ML2 vs HD74AC32FPEL-E feature comparison

MC74AC32ML2 onsemi

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HD74AC32FPEL-E Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer ON SEMICONDUCTOR RENESAS ELECTRONICS CORP
Package Description SOP, SOP14,.3 SOP, SOP14,.3
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.012 A 0.012 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Prop. Delay@Nom-Sup 10 ns 10 ns
Propagation Delay (tpd) 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Length 10.06 mm
Moisture Sensitivity Level 1
Seated Height-Max 2.2 mm
Width 5.5 mm

Compare MC74AC32ML2 with alternatives

Compare HD74AC32FPEL-E with alternatives