MC74AC259D
vs
HD74LS76ARP
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOIC-16
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
1:8 DMUX FOLLOWED BY LATCH
|
|
Family |
AC
|
LS
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
|
Length |
9.9 mm
|
9.9 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
D LATCH
|
J-K FLIP-FLOP
|
Max I(ol) |
0.012 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
2
|
Number of Functions |
1
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Output Polarity |
TRUE
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
RAIL
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Prop. Delay@Nom-Sup |
17 ns
|
|
Propagation Delay (tpd) |
17 ns
|
20 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
LOW LEVEL
|
NEGATIVE EDGE
|
Width |
3.9 mm
|
3.95 mm
|
Base Number Matches |
6
|
3
|
fmax-Min |
|
30 MHz
|
|
|
|
Compare MC74AC259D with alternatives
Compare HD74LS76ARP with alternatives