MC74AC258DR2
vs
DM74LS151SJX
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Package Description |
PLASTIC, SOIC-16
|
SOP, SOP16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
LS
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.9 mm
|
10.2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.012 A
|
0.008 A
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
INVERTED
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TR
|
TR
|
| Prop. Delay@Nom-Sup |
11 ns
|
46 ns
|
| Propagation Delay (tpd) |
10 ns
|
40 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
5.3 mm
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Power Supply Current-Max (ICC) |
|
10 mA
|
|
|
|
Compare MC74AC258DR2 with alternatives
Compare DM74LS151SJX with alternatives