MC74AC253DT
vs
74HC153PW,118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ONSEMI
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
PLASTIC, TSSOP-16
SOT-403-1, TSSOP-16
Pin Count
16
16
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e4
Length
5 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.012 A
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
260
Prop. Delay@Nom-Sup
17 ns
Propagation Delay (tpd)
17 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
4.4 mm
Base Number Matches
2
2
Manufacturer Package Code
SOT403-1
Factory Lead Time
4 Weeks
Moisture Sensitivity Level
1
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