MC74AC253DR2 vs HD74HC153FP feature comparison

MC74AC253DR2 onsemi

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HD74HC153FP Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description PLASTIC, SOIC-16 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AC HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Length 9.9 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.012 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 235 260
Prop. Delay@Nom-Sup 17 ns 29 ns
Propagation Delay (tpd) 17 ns 145 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.5 mm
Base Number Matches 5 2
Pbfree Code Yes
Time@Peak Reflow Temperature-Max (s) 20

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