MC74AC244NG vs TC74AC244P feature comparison

MC74AC244NG onsemi

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TC74AC244P Toshiba America Electronic Components

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type ENABLE LOW ENABLE LOW
Family AC AC
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e3
Length 26.415 mm 24.6 mm
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.012 A 0.024 A
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 10 ns 13 ns
Propagation Delay (tpd) 10 ns 13 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Samacsys Manufacturer Toshiba
Count Direction UNIDIRECTIONAL
Load Capacitance (CL) 50 pF
Power Supply Current-Max (ICC) 0.08 mA

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