MC74AC153DR2
vs
MC74AC257NC
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ONSEMI
MOTOROLA INC
Part Package Code
SOIC
Package Description
PLASTIC, SOIC-16
DIP,
Pin Count
16
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
AC
AC
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
Length
9.9 mm
19.175 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.012 A
Moisture Sensitivity Level
1
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
235
Prop. Delay@Nom-Sup
14.5 ns
Propagation Delay (tpd)
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.44 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
7.62 mm
Base Number Matches
2
1
Output Characteristics
3-STATE
Compare MC74AC153DR2 with alternatives
Compare MC74AC257NC with alternatives