MC74AC138MELG vs 74HC4514PW,112 feature comparison

MC74AC138MELG Rochester Electronics LLC

Buy Now Datasheet

74HC4514PW,112 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP2
Package Description PLASTIC, EIAJ, SOP-16 SOT-355, 24 PIN
Pin Count 16 24
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS ADDRESS LATCHES
Family AC HC/UH
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDSO-G16 R-PDSO-G24
JESD-609 Code e4 e4
Length 10.2 mm 7.8 mm
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Number of Functions 1 1
Number of Terminals 16 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 15 ns 69 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.275 mm 4.4 mm
Base Number Matches 2 2
Manufacturer Package Code SOT355-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP24,.25
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 69 ns
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74AC138MELG with alternatives

Compare 74HC4514PW,112 with alternatives