MC74AC138D
vs
933839650005
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
WAFER
|
| Package Description |
PLASTIC, SOIC-16
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Additional Feature |
3 ENABLE INPUTS
|
|
| Family |
AC
|
HC/UH
|
| Input Conditioning |
STANDARD
|
LATCHED
|
| JESD-30 Code |
R-PDSO-G16
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
4-LINE TO 16-LINE DECODER
|
| Max I(ol) |
0.012 A
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Prop. Delay@Nom-Sup |
15 ns
|
|
| Propagation Delay (tpd) |
15 ns
|
375 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Tin/Lead (Sn80Pb20)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
8
|
1
|
|
|
|
Compare MC74AC138D with alternatives
Compare 933839650005 with alternatives