MC74AC125D
vs
74CBTLV3126BQ-Q100
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
QFN
Package Description
SOP,
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, QFN-14
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
CBTLV/3B
JESD-30 Code
R-PDSO-G14
R-PQCC-N14
JESD-609 Code
e0
e4
Length
8.65 mm
3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
1
1
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVQCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)
10 ns
0.31 ns
Qualification Status
Not Qualified
Seated Height-Max
1.75 mm
1 mm
Supply Voltage-Max (Vsup)
6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2.3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
QUAD
Width
3.9 mm
2.5 mm
Base Number Matches
3
2
Rohs Code
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74AC125D with alternatives
Compare 74CBTLV3126BQ-Q100 with alternatives