MC74AC00N
vs
HD74AC00P-E
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
RENESAS ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AC
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Length
18.86 mm
19.2 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
11 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.69 mm
5.06 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
5
1
Rohs Code
Load Capacitance (CL)
50 pF
Max I(ol)
0.012 A
Moisture Sensitivity Level
1
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
10 ns
Schmitt Trigger
NO
Compare MC74AC00N with alternatives
Compare HD74AC00P-E with alternatives