MC7448VU867ND vs IBM25PPC740-DB0M2000 feature comparison

MC7448VU867ND NXP Semiconductors

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IBM25PPC740-DB0M2000 IBM

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Rohs Code Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS IBM MICROELECTRONICS
Package Description 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 BGA,
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32
Bit Size 32 32
Boundary Scan NO YES
Clock Frequency-Max 867 MHz 83.3 MHz
External Data Bus Width 64
Format FIXED POINT FLOATING POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-N360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 360 360
Operating Temperature-Max 105 °C 65 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code LGA BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 3.2 mm
Speed 867 MHz 200 MHz
Supply Voltage-Max 1.05 V 2.75 V
Supply Voltage-Min 0.95 V 2.65 V
Supply Voltage-Nom 1 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form NO LEAD BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 360

Compare MC7448VU867ND with alternatives

Compare IBM25PPC740-DB0M2000 with alternatives