MC7448VU1267ND
vs
PPC7448VS1267ND
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
LGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.1
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Address Bus Width
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
1267 MHz
1267 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CBGA-N360
S-CBGA-N360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Terminals
360
360
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
LGA
LGA
Package Equivalence Code
BGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8 mm
2.8 mm
Speed
1267 MHz
1267 MHz
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
1 V
1 V
Supply Voltage-Nom
1.05 V
1.05 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare MC7448VU1267ND with alternatives
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