MC7448VU1250ND
vs
PC7447VGU733NB
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELEDYNE E2V (UK) LTD
|
Package Description |
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
|
BGA,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.1
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Address Bus Width |
|
36
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
YES
|
Clock Frequency-Max |
1250 MHz
|
167 MHz
|
External Data Bus Width |
|
64
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
YES
|
JESD-30 Code |
S-CBGA-N360
|
S-CBGA-B360
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
360
|
360
|
Operating Temperature-Max |
105 °C
|
110 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
LGA
|
BGA
|
Package Equivalence Code |
BGA360,19X19,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.8 mm
|
3.2 mm
|
Speed |
1250 MHz
|
733 MHz
|
Supply Voltage-Max |
1.15 V
|
1.15 V
|
Supply Voltage-Min |
1.05 V
|
1.05 V
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
360
|
Additional Feature |
|
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
|
|
|
|
Compare MC7448VU1250ND with alternatives
Compare PC7447VGU733NB with alternatives