MC7447AVU733NB
vs
MC7447AVU733NB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
BGA,
|
BGA, BGA360,19X19,50
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.1
|
3A991.A.1
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
NXP
|
Additional Feature |
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
|
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
|
Address Bus Width |
36
|
36
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
167 MHz
|
167 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B360
|
S-CBGA-B360
|
Length |
25 mm
|
25 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
360
|
360
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.8 mm
|
2.8 mm
|
Speed |
733 MHz
|
733 MHz
|
Supply Voltage-Max |
1.35 V
|
1.35 V
|
Supply Voltage-Min |
1.25 V
|
1.25 V
|
Supply Voltage-Nom |
1.3 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
25 mm
|
25 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
360
|
JESD-609 Code |
|
e2
|
Package Equivalence Code |
|
BGA360,19X19,50
|
|
|
|
Compare MC7447AVU733NB with alternatives
Compare MC7447AVU733NB with alternatives