MC741VHC157DT vs SN74AHC157RGYRG4 feature comparison

MC741VHC157DT onsemi

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SN74AHC157RGYRG4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR TEXAS INSTRUMENTS INC
Part Package Code TSSOP QFN
Package Description TSSOP, HVQCCN, LCC16/20,.14X.16,20
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G16 R-PQCC-N16
Length 5 mm 4 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd) 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Width 4.4 mm 3.5 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Moisture Sensitivity Level 2
Package Equivalence Code LCC16/20,.14X.16,20
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9.5 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare MC741VHC157DT with alternatives

Compare SN74AHC157RGYRG4 with alternatives