MC68LC040RC33
vs
MC68LC040RC33B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
PGA, PGA179,18X18
PGA,
Reach Compliance Code
unknown
unknown
Bit Size
32
32
JESD-30 Code
S-XPGA-P179
S-CPGA-P179
JESD-609 Code
e0
Number of Terminals
179
179
Operating Temperature-Max
110 °C
Operating Temperature-Min
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Equivalence Code
PGA179,18X18
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Speed
33.3 MHz
33 MHz
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
HCMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
3
5
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Boundary Scan
YES
Clock Frequency-Max
66.66 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Length
47.245 mm
Low Power Mode
NO
Seated Height-Max
3.05 mm
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Width
47.245 mm
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