MC68HLC705KJ1CDW
vs
MC68HLC705KJ1CDWR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SOP, SOP16,.25
SOIC-16
Pin Count
16
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
OPERATES AT 3.3V SUPPLY @ 2.1MHZ
ALSO OPERATES AT 3.3V SUPPLY @ 2.1MHZ
Address Bus Width
Bit Size
8
8
CPU Family
6805
Clock Frequency-Max
8 MHz
8 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
Length
10.3 mm
10.3 mm
Moisture Sensitivity Level
1
Number of I/O Lines
10
10
Number of Terminals
16
16
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
64
ROM (words)
1240
ROM Programmability
OTPROM
OTPROM
Seated Height-Max
2.65 mm
2.65 mm
Speed
4 MHz
4 MHz
Supply Current-Max
0.06 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
HCMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
1