MC68HC908JK3CP
vs
MC68HC908JK3CDW
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
PLASTIC, DIP-20
|
SOP, SOP20,.4
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 3V MIN SUPPLY @ 4MHZ
|
OPERATES AT 3V SUPPLY @ 4 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
68HC08
|
68HC08
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G20
|
| Length |
26.415 mm
|
12.8 mm
|
| Number of I/O Lines |
15
|
15
|
| Number of Terminals |
20
|
20
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP20,.3
|
SOP20,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
128
|
128
|
| ROM (words) |
4096
|
4096
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
4.57 mm
|
2.65 mm
|
| Speed |
4 MHz
|
4 MHz
|
| Supply Current-Max |
10 mA
|
10 mA
|
| Supply Voltage-Max |
3.3 V
|
3.3 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
4
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
20
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
220
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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