MC68HC908GZ8CFJ
vs
MC68HC908GR8ACP
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
LQFP,
|
DIP, DIP28,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 3.3V SUPPLY @ 4 MHZ
|
OPERATES AT 3V SUPPLY @ 4.1MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
32 MHz
|
32.8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G32
|
R-PDIP-T28
|
| Length |
7 mm
|
36.83 mm
|
| Number of I/O Lines |
21
|
17
|
| Number of Terminals |
32
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
5.08 mm
|
| Speed |
8 MHz
|
8.2 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.8 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
7 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
4
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
28
|
| CPU Family |
|
68HC08
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
DIP28,.6
|
| RAM (bytes) |
|
384
|
| ROM (words) |
|
8192
|
| Supply Current-Max |
|
20 mA
|
|
|
|
Compare MC68HC908GR8ACP with alternatives