MC68HC908GR4MFA
vs
MC68HC908GR8CDW
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
QFP
|
SOIC
|
Package Description |
LQFP, QFP32,.35SQ,32
|
SOP, SOP28,.4
|
Pin Count |
32
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
OPERATES AT 3V SUPPLY @ 4.1 MHZ
|
OPERATES AT 3V SUPPLY @ 4.1 MHZ
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
68HC08
|
68HC08
|
Clock Frequency-Max |
32.8 MHz
|
32.8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G32
|
R-PDSO-G28
|
Length |
7 mm
|
17.9 mm
|
Number of I/O Lines |
21
|
17
|
Number of Terminals |
32
|
28
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
SOP
|
Package Equivalence Code |
QFP32,.35SQ,32
|
SOP28,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
384
|
384
|
ROM (words) |
4096
|
8192
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
2.65 mm
|
Speed |
8.2 MHz
|
8.2 MHz
|
Supply Current-Max |
20 mA
|
20 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
7 mm
|
7.5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
4
|
5
|
|
|
|
Compare MC68HC908GR4MFA with alternatives
Compare MC68HC908GR8CDW with alternatives