MC68HC705KJ1CP
vs
MC68HC705KJ1CS
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP16,.3
|
WINDOWED, CERDIP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
ALSO OPERATES AT 3.3V SUPPLY @ 2.1MHZ
|
OPERATES AT 3.3V SUPPLY @ 2.1MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
6805
|
68HC05
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Length |
19.175 mm
|
19.49 mm
|
| Number of I/O Lines |
10
|
10
|
| Number of Terminals |
16
|
16
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
WDIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE, WINDOW
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
64
|
64
|
| ROM (words) |
1240
|
1240
|
| ROM Programmability |
OTPROM
|
UVPROM
|
| Seated Height-Max |
4.44 mm
|
5.08 mm
|
| Speed |
4 MHz
|
4 MHz
|
| Supply Current-Max |
7 mA
|
7 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|