MC68HC705KJ1CDW vs MC68HC705KJ1CDW feature comparison

MC68HC705KJ1CDW Freescale Semiconductor

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MC68HC705KJ1CDW Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code SOIC SOIC
Package Description SOIC-16 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Additional Feature OPERATES AT 3.3V SUPPLY @ 2.1MHZ ALSO OPERATES AT 3.3V SUPPLY @ 2.1MHZ
Address Bus Width
Bit Size 8 8
CPU Family 6805 6805
Clock Frequency-Max 8 MHz 8 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e0
Length 10.3 mm 10.3 mm
Moisture Sensitivity Level 1
Number of I/O Lines 10 10
Number of Terminals 16 16
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
RAM (bytes) 64 64
ROM (words) 1240 1240
ROM Programmability OTPROM OTPROM
Seated Height-Max 2.65 mm 2.65 mm
Speed 4 MHz 4 MHz
Supply Current-Max 7 mA 7 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2

Compare MC68HC705KJ1CDW with alternatives

Compare MC68HC705KJ1CDW with alternatives