MC68HC705JP7S
vs
MC68HC705JP7S
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
WDIP,
WINDOWED, CERAMIC, DIP-28
Pin Count
28
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO OPERATES AT 2.7 TO 3.3V SUPPLY @1.05MHZ
OPERATES AT 3V SUPPLY @ 1.05 MHZ
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
4.2 MHz
4.2 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-CDIP-T28
R-CDIP-T28
Length
37.145 mm
37.145 mm
Number of I/O Lines
22
22
Number of Terminals
28
28
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
UVPROM
UVPROM
Seated Height-Max
6.09 mm
6.09 mm
Speed
2.1 MHz
2.1 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HCMOS
HCMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Boundary Scan
NO
CPU Family
6805
On Chip Program ROM Width
8
Package Equivalence Code
DIP28,.6
RAM (bytes)
224
ROM (words)
6160
Supply Current-Max
5.2 mA