MC68HC11F1MFN4
vs
MCHC11F1CFNE4R
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
QCCN, LCC68(UNSPEC)
|
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, LCC-68
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2016-07-20
|
1988-01-01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| CPU Family |
68HC11
|
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQCC-N68
|
S-PQCC-J68
|
| Low Power Mode |
NO
|
|
| Number of I/O Lines |
54
|
54
|
| Number of Terminals |
68
|
68
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
QCCJ
|
| Package Equivalence Code |
LCC68(UNSPEC)
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
220
|
250
|
| RAM (bytes) |
1024
|
|
| Speed |
4 MHz
|
4 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
J BEND
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
2
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
NXP
|
| Clock Frequency-Max |
|
16 MHz
|
| JESD-609 Code |
|
e3
|
| Length |
|
24.23 mm
|
| Moisture Sensitivity Level |
|
3
|
| ROM Programmability |
|
EEPROM
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Supply Voltage-Nom |
|
5 V
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
24.23 mm
|
|
|
|
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