MC68HC11E0MFNE2
vs
MC68HC11E9CFN3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
LCC-52
LCC-52
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
52 Weeks
Date Of Intro
1988-01-01
2016-07-20
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Additional Feature
SEATED HEIGHT CALCULATED
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
8 MHz
12 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
S-PQCC-J52
S-PQCC-J52
JESD-609 Code
e3
Length
19.125 mm
19.1262 mm
Moisture Sensitivity Level
3
Number of I/O Lines
38
38
Number of Terminals
52
52
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
250
ROM Programmability
ROM LESS
MROM
Seated Height-Max
5.08 mm
4.57 mm
Speed
2 MHz
3 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
19.125 mm
19.1262 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
5
CPU Family
68HC11
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Package Equivalence Code
LCC52,.75SQ
RAM (bytes)
512
ROM (words)
12288
Supply Current-Max
35 mA
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