MC68HC11A0FNR2
vs
MC68HC11A0FN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ,
|
,
|
| Pin Count |
52
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
2.1 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J52
|
S-PQCC-J52
|
| Length |
19.1262 mm
|
|
| Number of I/O Lines |
38
|
38
|
| Number of Terminals |
52
|
52
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Current-Max |
27 mA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
19.1262 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Boundary Scan |
|
NO
|
| CPU Family |
|
HC11
|
| Format |
|
FIXED-POINT
|
| Integrated Cache |
|
NO
|
| Low Power Mode |
|
YES
|
| Number of External Interrupts |
|
2
|
| Number of Serial I/Os |
|
1
|
| Number of Timers |
|
1
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
|
| RAM (bytes) |
|
256
|
| ROM (words) |
|
0
|
| Speed |
|
3 MHz
|
|
|
|