MC68HC09EL
vs
G65SC102DS-3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
CALIFORNIA MICRO DEVICES CORP
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
External Data Bus Width
8
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-CDIP-T40
R-GDIP-T40
Length
50.8 mm
Low Power Mode
YES
NO
Number of DMA Channels
Number of External Interrupts
3
2
Number of Serial I/Os
Number of Terminals
40
40
On Chip Data RAM Width
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
4.32 mm
5.72 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
40
Clock Frequency-Max
3 MHz
Operating Temperature-Max
70 °C
Operating Temperature-Min
Speed
3 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Temperature Grade
COMMERCIAL
Compare MC68HC09EL with alternatives
Compare G65SC102DS-3 with alternatives