MC68HC000P16
vs
MC68000R12F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
PLASTIC, DIP-64
PLASTIC, DIP-64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Motorola
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
16.67 MHz
16.67 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PDIP-T64
R-PDIP-T64
JESD-609 Code
e0
e0
Length
81.535 mm
81.535 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of External Interrupts
7
7
Number of Serial I/Os
Number of Terminals
64
64
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP64,.9
PGA68,10X10
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
5.84 mm
5.84 mm
Speed
16.67 MHz
16.67 MHz
Supply Current-Max
50 mA
50 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
3
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Compare MC68000R12F with alternatives