MC68EC020FG16R2
vs
TS80C188EC-20
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
INTEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP,
|
EIAJ, QFP-100
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Additional Feature |
DYNAMIC BUS SIZING; 3 PIPELINE STAGES
|
|
| Address Bus Width |
24
|
20
|
| Bit Size |
32
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
16.67 MHz
|
40 MHz
|
| External Data Bus Width |
32
|
8
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| Length |
20 mm
|
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
|
4
|
| Number of External Interrupts |
8
|
9
|
| Number of Serial I/Os |
|
2
|
| Number of Terminals |
100
|
100
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
3.1 mm
|
|
| Speed |
16.67 MHz
|
20 MHz
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Current-Max |
|
100 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC68EC020FG16R2 with alternatives
Compare TS80C188EC-20 with alternatives