MC68EC020FG16R2 vs SB80C188EC25 feature comparison

MC68EC020FG16R2 Motorola Mobility LLC

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SB80C188EC25 Intel Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC INTEL CORP
Part Package Code QFP QFP
Package Description QFP, LFQFP, QFP100,.63SQ,20
Pin Count 100 100
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Additional Feature DYNAMIC BUS SIZING; 3 PIPELINE STAGES
Address Bus Width 24 20
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 16.67 MHz 50 MHz
External Data Bus Width 32 8
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code R-PQFP-G100 S-PQFP-G100
Length 20 mm 14 mm
Low Power Mode NO YES
Number of DMA Channels
Number of External Interrupts 8
Number of Serial I/Os
Number of Terminals 100 100
On Chip Data RAM Width
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 3.1 mm 1.66 mm
Speed 16.67 MHz 25 MHz
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Package Equivalence Code QFP100,.63SQ,20
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
Supply Current-Max 125 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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