MC68B08P
vs
MC68HC09EL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
DIP, DIP40,.6
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
8 MHz
External Data Bus Width
8
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PDIP-T40
R-CDIP-T40
JESD-609 Code
e0
Length
52.07 mm
50.8 mm
Low Power Mode
YES
YES
Number of DMA Channels
Number of External Interrupts
2
3
Number of Serial I/Os
Number of Terminals
40
40
On Chip Data RAM Width
8
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
96
0
Seated Height-Max
5.08 mm
4.32 mm
Speed
2 MHz
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
2
Compare MC68B08P with alternatives
Compare MC68HC09EL with alternatives