MC68882RC25A
vs
5962-8946303YC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
MOTOROLA INC
Part Package Code
PGA
Package Description
PGA,
QFP, QFP68,1.1SQ,50
Pin Count
68
Reach Compliance Code
unknown
unknown
Address Bus Width
5
5
Boundary Scan
NO
NO
Bus Compatibility
MC68020; MC68030
Clock Frequency-Max
25 MHz
25 MHz
External Data Bus Width
32
32
JESD-30 Code
S-CPGA-P68
S-CQFP-G68
Length
26.92 mm
24.13 mm
Number of Terminals
68
68
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
QFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Seated Height-Max
2.59 mm
3.43 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
HCMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
PERPENDICULAR
QUAD
Width
26.92 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
4
6
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Barrel Shifter
YES
JESD-609 Code
e0
Package Equivalence Code
QFP68,1.1SQ,50
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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