MC68881RC12
vs
TS68882DESC05YA
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
THOMSON ELECTRON TUBES & DEVICES CORP
|
Package Description |
PGA, PGA68,10X10
|
QFP, QFP68,1.1SQ,50
|
Reach Compliance Code |
unknown
|
unknown
|
JESD-30 Code |
S-XPGA-P68
|
S-XQFP-G68
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
PGA
|
QFP
|
Package Equivalence Code |
PGA68,10X10
|
QFP68,1.1SQ,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK
|
Power Supplies |
5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
150 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
PIN/PEG
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
PERPENDICULAR
|
QUAD
|
Base Number Matches |
3
|
5
|
ECCN Code |
|
3A001.A.2.C
|
HTS Code |
|
8542.31.00.01
|
Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|