MC68824RC10H
vs
MC68824IFN10H
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Part Package Code |
PGA
|
|
| Package Description |
PGA,
|
QCCJ,
|
| Pin Count |
84
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
68000
|
68000
|
| Clock Frequency-Max |
10 MHz
|
10 MHz
|
| Communication Protocol |
ASYNC, BIT
|
SYNC, HDLC; LAPD
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
1.5625 MBps
|
1.5625 MBps
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-CPGA-P84
|
S-PQCC-J84
|
| JESD-609 Code |
e0
|
|
| Low Power Mode |
NO
|
NO
|
| Number of DMA Channels |
4
|
4
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
84
|
84
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
2.66 mm
|
4.57 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
3
|
2
|
| Length |
|
29.285 mm
|
| Width |
|
29.285 mm
|
|
|
|
Compare MC68824RC10H with alternatives
Compare MC68824IFN10H with alternatives