MC68681FN
vs
SCC2692AC1F28
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
PHILIPS SEMICONDUCTORS
Package Description
PLASTIC, LCC-44
DIP, DIP28,.6
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
4
Boundary Scan
NO
Bus Compatibility
68000
Clock Frequency-Max
4 MHz
Communication Protocol
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
Data Transfer Rate-Max
0.125 MBps
External Data Bus Width
8
JESD-30 Code
S-PQCC-J44
R-CDIP-T28
JESD-609 Code
e0
e0
Length
16.5862 mm
Low Power Mode
NO
Number of DMA Channels
Number of I/O Lines
14
Number of Serial I/Os
2
Number of Terminals
44
28
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.57 mm
Supply Current-Max
150 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
16.5862 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
3
3
Package Equivalence Code
DIP28,.6
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