MC68661LB
vs
MC68661PB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
2
2
Boundary Scan
NO
NO
Bus Compatibility
MC68000
MC68000
Clock Frequency-Max
5.07 MHz
5.07 MHz
Communication Protocol
ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC
ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
8
8
JESD-30 Code
R-CDIP-T28
R-PDIP-T28
Length
35.56 mm
36.83 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of I/O Lines
Number of Serial I/Os
1
1
Number of Terminals
28
28
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
4.19 mm
5.08 mm
Supply Current-Max
150 mA
150 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
2
2
Compare MC68661LB with alternatives
Compare MC68661PB with alternatives