MC68332ACAG20
vs
MC68LK332GCEH16
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-144
0.950 X 0.950 INCH, 0.025 INCH PITCH, PLASTIC, ROHS COMPLIANT, QFP-132
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
13 Weeks
Date Of Intro
1988-01-01
1988-01-01
Samacsys Manufacturer
NXP
NXP
Has ADC
NO
NO
Address Bus Width
24
24
Bit Size
32
32
Clock Frequency-Max
20 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G144
S-PQFP-G132
JESD-609 Code
e3
e3
Length
20 mm
24.13 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
24
31
Number of Terminals
144
132
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
BQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, BUMPER
Peak Reflow Temperature (Cel)
260
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
4.572 mm
Speed
20 MHz
16 MHz
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
HCMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
30
Width
20 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Boundary Scan
NO
ROM Programmability
ROM LESS
Compare MC68332ACAG20 with alternatives
Compare MC68LK332GCEH16 with alternatives