MC68330FE8V
vs
TSX68020VFB/C25
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELEDYNE E2V (UK) LTD
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Technology |
CMOS
|
HCMOS
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
QFP
|
| Package Description |
|
QFP,
|
| Pin Count |
|
132
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
25 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-CQFP-G132
|
| JESD-609 Code |
|
e4
|
| Length |
|
24.13 mm
|
| Low Power Mode |
|
YES
|
| Number of Terminals |
|
132
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
QFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Seated Height-Max |
|
3.43 mm
|
| Speed |
|
25 MHz
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
GOLD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.635 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
24.13 mm
|
|
|
|
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