MC68330FE8V
vs
NG80386DXL-25S
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
,
|
GQFF, TPAK132,1.8SQ,25
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
4
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
132
|
| ECCN Code |
|
3A991.A.2
|
| Address Bus Width |
|
30
|
| Bit Size |
|
32
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
50 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-30 Code |
|
S-PQFP-F132
|
| JESD-609 Code |
|
e0
|
| Length |
|
24.0792 mm
|
| Low Power Mode |
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
2
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
|
132
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
GQFF
|
| Package Equivalence Code |
|
TPAK132,1.8SQ,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, GUARD RING
|
| Qualification Status |
|
Not Qualified
|
| RAM (words) |
|
0
|
| Seated Height-Max |
|
4.8 mm
|
| Speed |
|
25 MHz
|
| Supply Current-Max |
|
250 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
FLAT
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
24.0792 mm
|
|
|
|
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