MC68030RC16C
vs
MC68030RC20C
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
PGA,
|
PGA,
|
| Pin Count |
128
|
128
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DYNAMIC BUS SIZING;UPTO 9.2 MIPS
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
X-XPGA-P128
|
S-CPGA-P128
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
128
|
128
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Clock Frequency-Max |
|
20 MHz
|
| Length |
|
34.545 mm
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
7
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| RAM (words) |
|
0
|
| Seated Height-Max |
|
3.81 mm
|
| Speed |
|
20 MHz
|
| Terminal Pitch |
|
2.54 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
34.545 mm
|
|
|
|
Compare MC68030RC16C with alternatives
Compare MC68030RC20C with alternatives