MC68030FE25C vs NG80386DXL-25S feature comparison

MC68030FE25C Motorola Semiconductor Products

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NG80386DXL-25S AMD

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC ADVANCED MICRO DEVICES INC
Package Description CERAMIC, QFP-132 GQFF, TPAK132,1.8SQ,25
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 30
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 25 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CQFP-G132 S-PQFP-F132
Length 22.355 mm 24.0792 mm
Low Power Mode NO YES
Number of DMA Channels
Number of External Interrupts 7 2
Number of Serial I/Os
Number of Terminals 132 132
On Chip Data RAM Width
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QFP GQFF
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, GUARD RING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 4.31 mm 4.8 mm
Speed 25 MHz 25 MHz
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING FLAT
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 22.355 mm 24.0792 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 4 1
Rohs Code No
Part Package Code QFP
Pin Count 132
ECCN Code 3A991.A.2
JESD-609 Code e0
Operating Temperature-Max 100 °C
Package Equivalence Code TPAK132,1.8SQ,25
Supply Current-Max 250 mA
Temperature Grade OTHER
Terminal Finish TIN LEAD

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