MC68030FE20C vs UT1750AR12WBC feature comparison

MC68030FE20C Rochester Electronics LLC

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UT1750AR12WBC Cobham Semiconductor Solutions

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Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC AEROFLEX COLORADO SPRINGS
Part Package Code QFP QFP
Package Description QFP, QFF,
Pin Count 132 132
Reach Compliance Code unknown unknown
Address Bus Width 32 16
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 20 MHz 12 MHz
External Data Bus Width 32 16
Format FIXED POINT FLOATING POINT
Integrated Cache NO NO
JESD-30 Code S-CQFP-G132 S-CQFP-F132
Length 22.355 mm 24.13 mm
Low Power Mode NO NO
Moisture Sensitivity Level 1
Number of Terminals 132 132
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFP QFF
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.31 mm 2.794 mm
Speed 20 MHz 12 MHz
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish NOT SPECIFIED
Terminal Form GULL WING FLAT
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 22.355 mm 24.13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 4 1
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01
Operating Temperature-Max 125 °C
Screening Level MIL-PRF-38535 Class Q
Temperature Grade MILITARY

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